MIcron recently announced that it has begun shipping out its HBM4 memory modules to key customers. These include the 36GB modules, built on its 1-beta, 12-high advanced packaging technology.
“Micron Technology, Inc. (Nasdaq: MU), today announced the shipment of HBM4 36GB 12-high samples to multiple key customers. This milestone extends Micron’s leadership in memory performance and power efficiency for AI applications. Built on its well-established 1ß (1-beta) DRAM process, proven 12-high advanced packaging technology and highly capable memory built-in self-test (MBIST) feature, Micron HBM4 provides seamless integration for customers and partners developing next-generation AI platforms.”
Performance-wise, HMB4 delivers more than 2TB/s bandwidth per memory stack, through a 2048-bit interface. Roughly calculated, that’s an over 60% increase in performance over the previous generation HBM3E. Additionally, Micron claims that it has also improved power efficiency over the last generation, reducing power consumption in large-scale AI systems by more than 20%.
“Micron HBM4’s performance, higher bandwidth and industry-leading power efficiency are a testament to our memory technology and product leadership. Building on the remarkable milestones achieved with our HBM3E deployment, we continue to drive innovation with HBM4 and our robust portfolio of AI memory and storage solutions. Our HBM4 production milestones are aligned with our customers’ next-generation AI platform readiness to ensure seamless integration and volume ramp.” – Raj Narasimhan, senior vice president and general manager of Micron’s Cloud Memory Business Unit.
One of Micron’s main key customers is NVIDIA and its Vera Rubin platform, while another is AMD and its Instinct MI400 server CPU.
(Source: Micron, Videocardz)
