Samsung recently announced that it has begun mass production for what its calls the industry’s thinnest 12nm-class LPDDR5X DRAM packages. Specifically, the company has started production of its 12GB and 16GB memory modules.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
The new LPDDR5X memory packages offer 12nm memory in a 4-stack structure, which the brand says reduces the component’s overall thickness by approximately 9% and improves heat resistance by 21.2% when compared to previous generation memory produces.
“By optimizing printed circuit board (PCB) and epoxy moulding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65mm, the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.”
(Source: Samsung)
