Qualcomm has kicked off its CES 2017 show by releasing new information about its upcoming Snapdragon 835 processor. Thus far, we had already been informed that the Snapdragon 835 will be built on the 10nm process; but that was about as much as anyone was told.
The new post by Qualcomm (reproduced by @evleaks) reaffirms the “40 percent less power” and “27 percent performance increase” over the Snapdragon 820. It also reveals that the new die size means that the processor is now 30 percent smaller than its predecessor as well. This essentially means that there will be more space for manufacturers to squeeze in larger batteries, or room to shrink the size of the phone.
Interestingly, Qualcomm is sticking to its Quick Charge feature, despite Google indirectly asking it to cut that kind of thing out.
Inside the Snapdragon 835 is a Qualcomm Kryo 280 CPU, Qualcomm Adreno 540 GPU, and Qualcomm Hexagon DSP. The actual benchmarks of these components hasn’t been revealed. It would be nice to have some numbers, and with any luck Qualcomm will have them shared at some point in this coming week.
Virtual reality is also on Qualcomm’s mind, and the Snapdragon 835 is said to offer “25 percent faster 3D graphic rendering and 60X more display colors when compared to Snapdragon 820.”
There is still no mention of when the Snapdragon 835 will be making an appearance, although the middle of the year is looking more and more likely.