We all know that the iPhone SE is basically an iPhone 6s crammed into a slightly tweaked body of an iPhone 5s. According to the first teardown of the device, which goes on sale officially starting today, not only does the iPhone SE feature parts from its predecessors, there are also some completely new parts inside too.
First up, the iPhone SE uses the same A9 processor as the iPhone 6s. It is manufactured by TSMC, and has the same 2GB of LPDDR4 RAM as the iPhone 6s. The date marked on the part is around August/September 2015, which means that it’s been available for a while now and was most likely intended for the iPhone 6s.
Other parts borrowed from the iPhone 6s include the NXP 66VIO NFC solution that consists of Secure Element 008 and NXP PN549, the 6-axis sensor used for things like accelerometer and gyroscope, the same Qualcomm MDM9625M modem, and the 338S00105 and 338S1285 Audio ICs. As for the touchscreen controller, Apple is using the same Broadcom BCM5976 and Texas Instruments 343S0645 as the iPhone 5s, which explains why there is no 3D touch on board.
The iPhone SE isn’t powered by all recycled bits though, the new components include a Skyworks SKY77611 power amplifer module, a Texs Instrument 338S00170 power management IC, a Toshiba THGBX5G7D2KLDXG NAND flash, an EPCOS D5255 antenna switch module, and an AAC Technologies 0DALM1 microphone.
For those who would like to get technical and see the parts for yourself, check out Chipworks.
