Details of Huawei’s upcoming Kirin 970 processor have purportedly leaked. This comes from a Weibo user who claims to be familiar with the Taiwanese mobile phone industry, and the leaked details are not entirely too outlandish.
According to the leaks, the Kirin 970 will be built using TSMC’s 10nm manufacturing process; marking it as a first for Huawei. In theory, this will allow the company to squeeze more power and efficiency into the chip, but we are willing to wait to see what kind of improvements this translates into.
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Other specifications reveal that the Kirin 970 will be an octa-core processor that pairs four Cortex-A73 cores with four Cortex-A53 cores. It’s not an uncommon configuration for mobile processors, although the base clock speed of between 2.8 and 3.0 GHz falls on the upper end of specifications. If this is true, it will at least be comparable to Qualcomm’s Snapdragon 835 processor.
The Kirin 970 is expected to be revealed early next year; when it will go into mass production. Unfortunately, this means that it will not be ready for Huawei’s next generation of phones. It’s impossible to guess as to when it will actually be appearing on the market without an official statement from Huawei.
[Source: Gizchina]
