Intel’s alleged March launch of its 11th Gen Rocket Lake-S series CPU is just around the corner, but that hasn’t stopped new ones to continue springing from its already rusty pipes. On that note, the most recent leaks seemingly show off the alleged design renders for the packaging of its Core i9 lineup.
The renders were first posted by Videocardz and from the looks of it, the new packaging designs seem to match Intel’s new logo designs for the 11th Gen CPUs. In the case of the Core i9-11900K, the CPU’s packaging seems to take on a more polygonal design, complete with its angular cuts on both sides.
This is obviously not the first time Intel has designed and made an over-the-top packaging for its high-end CPUs. Back in 2019, Intel launched its Core i9-9900KS with a special 3D, octagonal container to enclose the processor. Last year, the company dialled back a little and released a slightly more modest packaging for its 10th Gen Core i9 series.
The post doesn’t provide any further details about the Core i9-11900K lineup, sadly, but as it stands, we technically already know what to expect. As per our initial reports, the Rocket Lake-S is to be the last of Intel’s already ageing 14nm process node, before the chipmaker finally moves on to its 10nm die lithography. In addition, the new CPU lineup will support PCIe 4.0, among other things, as well as feature a new 500 series motherboard to accommodate those upgrades.
(Source: Videocardz // Image: Videocardz)