Back in January last year, semiconductor manufacturer, TSMC, began work on the construction of its new 5nm fabrication. Now, the company has reported that it has completed its production of the new process node.
TSMC’s new 5nm process will be aimed at SoC designs, 5G and artificial intelligence (AI) applications, along with high-performance computing. Statistically, the new 5nm process will deliver 1.8 times the logic density on an ARM Cortex-A72 core processor. In comparison with the current 7nm die lithography.
Additionally, TSMC also completed the development of its 5nm Design Rule Manual (DRM), Simulation Program with Integrated Circuit Emphasis (SPICE), and process design kits (PDK).
TSMC’s entire 5nm design infrastructure is already available via its official online site for customer downloads. The company hasn’t indicated any new timelines for its new process node, which could possibly mean it is still on track for seeing mass production of the chip sometime during the year 2020.