Qualcomm revealed that the company is currently developing a VR headset. Specifically, the semiconductor company is working on creating a wireless PC-connected, head mounted display (HMD).
The initiative is known as “Boundless XR for PC”. A dual mode headset that is powered by a Qualcomm Snapdragon 845 SoC and wireless 802.11ad chip. The latter being capable of providing a 60GHz high-bandwidth connection, ensuring latency is kept at a minimum for split-processing between the VR headset and the PC.
The headset works as a standalone which Qualcomm and has six degrees of freedom (6DoF) head and controller tracking, thus eliminating the need for cables. When in proximity with a PC, the headset is designed to wirelessly connect to the PC and utilise the rendering resources from it.
Qualcomm says that the first commercial headset to support its Boundless XR initiative will be called the Pico Neo 2 VR headset, and is expected to hit the market sometime during the second half of 2019. The company also says that HTC Vive and Viveport will support Boundless XR’s new specification through hardware and content, although no solid timeline for such product has been announced.