Qualcomm has just announced the availability of the new Snapdragon 670 (SD670) chipset. Despite being part of the company’s Snapdragon 600-series line-up, the new SoC is an octa-core processor that has more similarities with the recent Snapdragon 710 (SD710) rather than its predecessor.
The new SoC comprises of two ‘big’ cores and six ‘little’ cores – 2x Kryo 360 plus 6x Kryo 360 – where the big cores are based on the Cortex-A75 and the smaller cores are based on the Cortex-A55. The cores run at 2.0GHz and 1.7GHz respectively. According to Qualcomm, the new cores are offer 25% better performance when compared to the Snapdragon 660 (SD660).
Built using the 10nm LPP manufacturing process, the Snapdragon 670 also apparently able to offer better power efficiency when compared to the older 14nm process. There is also a new GPU inside the SD670 which comes in the form of the Adreno 615 although there are still some features that were carried over from SD660 including X12 LTE modem and up to Full HD+ screen.
Thanks to its image signal processor which identical to the one inside SD710, the SD670 can be paired with dual cameras too. Specifically, it can either support up to a single 25MP sensor or dual 16MP cameras. Qualcomm has also included the 3rd generation AI Engine from the SD710 that should improved the SoC’s AI performance as compared to its predecessors.
As manufacturer already have access to SD670, consumers can expect to see new smartphone featuring the new SoC in the market very soon.
(Source: Qualcomm)
