Images of the purported Moto X have been leaked showing an two rows of unidentified connectors on the back. Serial leaker Evan Blass – also known as @evleaks – has now contributed a report to VentureBeat where he reveal that these connectors may be used for a swappable backplate.
The backplates will apparently be called “Amps” and will be made available immediately at launch. The Moto X will include a simple coloured backplate in the packaging, but it is the other first party modules that are of interest.
The report notes that the other Amps include stereo speakers, a battery pack, a camera grip with flash and optical zoom, a pico projector and even a rugged cover with wide angle lens attachment. Third-party manufacturers will likely be making the modules as well, and it will be interesting to see what they have to offer.
The Moto X is not the first modular smartphone to hit the market, and the technology will draw comparisons with the LG G5. That being said, Lenovo’s take on the idea of modular components will be interesting to see once an official announcement is made.
Few other details are available, but there has already been speculation about the all metal body of the Moto X. Rumour has it that the Moto X will be launched at Lenovo Tech World on 9 June.