Qualcomm’s next flagship chip is set to be announced sometime in December. Thanks to a leaked invite, the rumoured Snapdragon 845 SoC may be announced at an event called the Snapdragon Technology Summit in Hawaii.
The flagship chipset is destined for 2018’s headline flagship smartphones from companies like Samsung, HTC, Xiaomi, and many more. Interestingly, the Snapdragon 845 is said to still be manufactured using the 10nm FinFET manufacturing process.
Like the Snapdragon 835, the new chip is said to have an eight-core structure, with four ARM Cortex-A75 cores and four ARM Cortex-A53 cores on the silicon. The chip may also be paired with the new Adreno 630 GPU.
The timing of the announcement is similar as when the Snapdragon 835 was announced in 2016. It sounds like great news for Samsung as well, with the company rumoured to have snapped up the first batch of Snapdragon 845 units for its Galaxy S9 flagship coming early next year.
