We’ve seen a lot of pictures claiming to be the rear casing of the upcoming iPhone 7, but what about pictures of the inside? The latest leak we are seeing now claims to be the A10 chipset from the Cupertino company, which will be used on the iPhone 7.
Apple has been upgrading the processor on its iPhone every year. The current iPhone 6s and iPhone 6s Plus are powered by the A9 processor (the iPad Pro uses an A9X processor), so it makes sense that the iPhone 7 will be using an upgraded A10 processor.
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The image was first posted on a blog on popular Chinese social network, Weibo. Over the weekend, the same blog also leaked some pictures claiming to be the logic board components for the iPhone 7 (pictured above). Sadly though, the leak does not provide any further details about the A10 chip. According to MacRumors, the picture here is not of a complete A10 chip, and may be the RAM layer stacked on top of the A10 wafer as one SoC.
Again, take this leak with a pinch of salt. Apple has not confirmed anything about the iPhone 7, though, they are expected to launch the device early next month. The latest report from Bloomberg says that the launch event of the iPhone 7 will be happening on 7 September 2016. Earlier leak suggests that the device will be available for purchase (in selected countries of course), on the “week of September 12th”.
