We’ve seen reports back in February of TSMC accelerating the building of its chip plants in Arizona. More recently, it looks like the company is dialling things up even further. The company has been reported as saying that it is speeding up the building of the second and third plants “by several quarters”.
Nikkei Asia reports that this is “to meet robust demand from US-based customers for smartphone and AI computing chips”. The company is noted to have made a US$100 billion (~RM424.25 billion) investment earlier in the year to build five more facilities in Arizona. This includes two chip packaging plants and the production of 2nm and better chips.
The report cites C C Wei, TSMC chairman and CEO, as saying that “after completion, around 30% of our 2nm and more advanced [chip] capacity will be located in Arizona”. In turn, this means revenue growth of over 30%, subject to US President Donal Trump’s tariff policy, naturally.
Wei also mentions the creation of “an independent, leading-edge semiconductor manufacturing cluster in the US”. The two planned advanced chip packaging facilities and R&D centre is noted to “complete the AI supply chain” in the US.
(Source: Nikkei Asia)
