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Home Artifical Intelligence

Qualcomm Unveils Various AI Innovations During MWC 2024

These include the new Qualcomm AI Hub, as well as Snapdragon X80 5G Modem-RF and Fast Connect 7900 systems.

by Heirul Kamel
February 28, 2024
Qualcomm AI Innovations MWC 2024

Image: Qualcomm

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Qualcomm recently unveiled its latest lineup of on-device AI, intelligent computing, and wireless connectivity products during this year’s Mobile World Congress (MWC) event held in Barcelona. According to the company, these new products are aimed at accelerating digital transformation, fostering economic growth, and expanding the integration of AI and connectivity into new areas. 

Among those revealed at the event include the new Qualcomm AI Hub, which boasts a fresh library of over 75 pre-optimised AI models tailored for seamless deployment on devices powered by Snapdragon and other platforms from the company. Developers can easily integrate these models into their applications, reducing time-to-market and unlocking the benefits of on-device AI implementations such as  immediacy, reliability, privacy, personalisation and cost savings. These models are accessible through the Qualcomm AI Hub, Hugging Face and GitHub, enabling developers to run them with a few lines of code on cloud-hosted devices powered by Qualcomm platforms.

Qualcomm AI Innovations MWC 2024
Image: Qualcomm
Qualcomm AI Innovations MWC 2024
Image: Qualcomm

Next up is the Snapdragon X80 5G Modem-RF System, which Qualcomm touts as the world’s most advanced 5G modem-to-antenna platform. Integrating 5G-Advanced capabilities, it is the first modem with fully integrated NB-NTN satellite communications support for connectivity to non-terrestrial networks. A dedicated tensor accelerator drives AI optimisation, enhancing throughput, quality of service (QoS), coverage, latency, spectrum efficiency, power efficiency, and mmWave beam management.

Qualcomm AI Innovations MWC 2024
Image: Qualcomm

Lastly, the FastConnect 7900 mobile connectivity system is highlighted as the first to deliver AI-optimised performance while integrating Wi-Fi 7, Bluetooth, and Ultra Wideband technologies into a single chip. Leveraging AI, FastConnect 7900 adapts to various usage scenarios and environments, providing significant optimizations in power consumption, network latency, and throughput. By incorporating Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding, FastConnect 7900 offers a comprehensive suite of proximity technologies, enabling secure device discovery, access, and control.

ALSO READ:  Gobind: AI Regulatory Framework In The Works
Qualcomm AI Innovations MWC 2024
Image: Qualcomm

Qualcomm anticipates generative AI to have a widespread impact across various industries. During MWC 2024, the company demonstrated the technology across various device categories, including flagship smartphones such as the HONOR Magic6 Pro, OPPO X7 Ultra and Xiaomi 14 Pro, as well as on PC via the Snapdragon X Elite platform.

(Source: Qualcomm press release / official website)

Filed Under 5GAIAI HubFastConnect 7900InnovationMWC 2024qualcommsnapdragonTechnology
Updated 6:22 pm, Wed, 28 February 24
http://lowy.at/vqERQ
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