TP-Link is a well-known brand for network equipment but it does offer smartphone in our market as well. Positioned under the Neffos series, the company today has launched its latest smartphones – the X1 and X1 Max – in Malaysia.
First unveiled to the world at IFA 2016, TP-Link decided to have metallic back cover on these new phones in order to provide premium feel to them. At the same time, they are also powered by the same MediaTek Helio P10 octa-core processor.
Other than that, both X1 and X1 Max are equipped with a f/2.0 lens and 13-megapixels Sony IMX258 sensor that also provides PDAF feature for its rear camera. On the front, both smartphones are provided with a 5-megapixels camera.
As you might be able to see, the main element that differentiate both phone are their displays. Specifically, the X1 comes with a 5-inch HD (1280 x 720) IPS display while the X1 Max features a 5.5-inch full HD (1920 x 1080) IPS display.
Other than that, they also carry different amount of battery capacity within them with the X1 Max having the higher capacity 3,000 mAh as compared to X1’s 2250 mAh battery. They are also available with two different RAM and internal storage configuration each.
In terms of availability, the X1 can be obtained immediately in our market with a price tag of RM 769 for the model with 2GB RAM and 16GB internal storage while the 3GB RAM and 32GB storage is going for RM 849 complete with a special promotion at Lazada Malaysia.
As for the X1 Plus, it will only available in our market in March 2017 although TP-Link has actually revealed the phone’s pricing at the launch event today with the 3GB RAM/32GB model will go for RM 999 while the 4GB/64GB is listed at RM 1,199.
For the meantime, don’t forget to check out our hands-on experience with the Neffos X1 right here.
