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Home Hardware Semiconductor Chips

AMD To Establish Malaysia As Hub For Advanced Chip Packaging And Design

Prime Minister Anwar Ibrahim and AMD CEO Dr Lisa Su held a virtual meeting yesterday to discuss the company's local expansion.

by Heirul Kamel
May 7, 2025
AMD Malaysia hub chip design packaging

Image: Anwar Ibrahim, via Facebook

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Advanced Micro Devices Inc (AMD) plans to make Malaysia its strategic hub for advanced semiconductor packaging and design, with operations focused in Penang and Cyberjaya. Prime Minister Datuk Seri Anwar Ibrahim, speaking at an East Coast Rail Link (ECRL) event yesterday, confirmed the company’s intention and said the government would extend full support to expedite the process.

He noted that while Malaysia has traditionally played a back-end role in the semiconductor sector, AMD’s latest commitment signals a shift toward higher-value activities such as chip design and advanced packaging. It should be noted that the company has had operations in Malaysia since 1972, and currently employs over 800 staff across its Global Shared Services facilities in Penang and Cyberjaya.

Anwar said the discussions were held with AMD CEO Dr Lisa Su virtually earlier in the day, and the government was ready to provide the necessary infrastructure and policy support to accelerate AMD’s expansion. He added that the company expressed support for the National Semiconductor Strategy (NSS), which is aimed at ensuring a diversified and resilient supply chain while strengthening Malaysia’s position in the global semiconductor ecosystem.

AMD-Ryzen-9-9950X3D-Key-Product-Shot-2

The Prime Minister also emphasised that Malaysia remains a free and sovereign country, maintaining neutrality in global trade matters. While the government is still evaluating its response to US-imposed tariffs, Anwar pointed out that companies like AMD continue to show strong confidence in Malaysia by committing to long-term investments.

(Source: Anwar Ibrahim, via Facebook / FMT)

Filed Under AMDAnwar IbrahimchipdesignhubLisa SuMalaysiapackagingSemiconductor
Updated 10:06 am, Wed, 7 May 25
https://lowy.at/c26ea
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