MediaTek officially unveiled Dimensity, the brand’s first 5G chipset featuring a single-chip solution with an integrated 5G modem. Officially known as the Dimensity 1000, the SoC is built on a 7nm die lithography and comes packed with loads of new features.
Hardware-wise, Dimensity uses an octa-core CPU comprising four ARM Cortex-A77 and four ARM Cortex-A55. With the A77 cores are designed to operate at speeds of up to 2.6GHz. For its GPU, the Dimensity runs on an ARM Mali-G77 MC9.
Moving on, the Dimensity is also MediaTek’s first SoC to feature a six-core AI Processing Unit (APU), known officially as APU 3.0. It comprises two big cores, three small cores, and a single tiny core. When put to use, MediaTek says that APU 3.0 is capable of a performance of up to 4.5 Tera Operations per Second (TOPS).
Dimensity also supports Wi-Fi speeds within the sub-6GHz spectrum. Delivering up to 4.7Gbps, plus full 5G stand alone and non-stand alone support, as well as seamless handover for 5G, enabling the chipset to move between high-speed connections seamlessly while on the go.
Of course, you can speak about a new mobile chipset without addressing the prowess of its Image Signal Processor (ISP). In this case, Dimensity comes with a five-core ISP, plus MediaTek’s Imageq+ technology. Simply put, this enables the chipset to support camera sensors with 80MP resolutions at 24 fps.
On the other hand, MediaTek also says that the ISP can also support several multi-camera configurations. Needless to say, the ISP can also be coupled with APU 3.0, providing users control to several AI-based camera enhancements, including autofocus, auto exposure, and auto white balance, to name a few.
At the time of writing, MediaTek did not state when it intends to make Dimensity available to the masses, neither did it mention which of its smartphone partners would first adopters of the new chipset.
(Source: PR Newswire)
