Qualcomm’s current flagship chipset, the Snapdragon 855 SoC, is blazing its way through this year’s premium smartphone list. Of course, this hasn’t curtailed the semiconductor maker from working on their follow-up flagship, the Snapdragon 865.
New details regarding the Qualcomm 865 SoC recently popped up online via the Twitter account of leakster and WinFuture writer, Roland Quandt (@rquandt). According to Quandt, the company’s next-generation premium chipset will be codenamed the SM8250, and will be split into two variants: Kona and Huracan.
Quandt continues on with the supposed specifications of the unreleased high-end chipsets, stating that both of them will support a new LPDDR5X memory standard, and the faster UFS 3.0 storage medium. Further, Quandt speculates that of the two, one of the Snapdragon 865 variants be integrated with 5G modem. Specifically, Qualcomm’s SDX55 modem.
Snapdragon 865 is what Qualcomm employees call the next gen high-end SoC (SM8250). There are two variants: Kona + Huracan. Both with support for LPDDR5X RAM and UFS 3.0. One likely with, one without integrated 5G modem (SDX55) – I guess. Also no clue which is the one w/ 5G in it.
— Roland Quandt (@rquandt) June 14, 2019
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Considering that the current Snapdragon 855 SoC already uses the lightning fast LPDDR4X memory, we can’t imagine how much faster the new LPDDR5X memory would be. Adding to the rumour basket is the possibility of Samsung helping the company manufacturer the 7nm process node it would be based on.
At the time of writing, it is unclear when Qualcomm intends to launch or announce the Snapdragon 865 SoC. Considering its on-going development trend, it’s likely that we could see the chipset making its way into the hearts of high-end flagship device as early as 2020.
(Source: Twitter via Hot Hardware)
