Intel is set to invest close to US$5 billion (~RM23.2 billion) building a new semiconductor assembly line and test facility in the European country of Poland. The plant is part of the chipmaker’s latest project that is part of the US CHIPS act that was signed in to the country’s legislation back in July last year.
“With this investment today, and others in the EU, we’re excited to play a critical enabling point to building these more resilient supply chains,” Pat Gelsinger, CEO of Intel said at a press conference announcing the investment in Wroclaw, Poland recently.
To provide some context, the CHIPS act that was signed in by the US Senate last year would see the country allocate US$53 billion (~RM245.95 billion) to US-based companies, so that they can reduce their reliance on components manufactured in China. In light of that deal, the EU and its Parliament agreed to a final proposal that would see a sum of €43 billion (~RM217 billion) flow into its semiconductor industry, with the same goal of reducing its reliance on China’s provision of chips as well.
The new Intel Fab will be built in Western Poland and more specifically, within the city of Wroclaw. As explained by Bloomberg, the new plant won’t be wafer fabrication facilities, or fabs, that create chips on silicon wafers through chemical, mechanical and optical processes. Instead of assembly and test facilities, such as the one planned in Poland, it will receive completed wafers from fabs, cut them into individual chips, assemble them into final products and test them for performance and quality.
The new Intel fab plant will also be expected to create 2,000 jobs with its initial opening, followed by several thousands more, primarily from indirect suppliers and temporary construction operations.
