Not enough with three new Snapdragon processors which include Snapdragon 865, 765, and 765G, Qualcomm has also introduced another new product during Day 1 of the Snapdragon Tech Summit 2019 in Hawaii. However, it is not another SoC though but instead, the product is a brand-new ultrasonic fingerprint sensor called 3D Sonic Max.
According to the company, the new 3D Sonic Max has recognition area that is 17 times larger than its previous ultrasonic fingerprint sensor. Hence, it is not exactly a surprise to see the company claimed its new sensor as the largest of its kind in the world.
Not only that it is significantly larger than its predecessor, the 3D Sonic Max is apparently more accurate as well. Furthermore, the sensor is also able to process two fingers simultaneously.
The company believes that the 3D Sonic Max can be utilized not only in smartphones but in other segments as well such as automotive, medical and IoT. However, the company didn’t reveal any timeline for its new ultrasonic fingerprint scanner.
